Technical Lead - Signal and Power Integrity
Overview
The US Research & Venture Team is seeking an experienced Electrical Engineer to lead advanced Signal Integrity and Power Integrity development for next‑generation semiconductor test systems. This role spans high‑speed electrical design, system‑level analysis, prototype evaluation, and cross‑functional integration involving electrical, optical, mechanical, and thermal technologies. The position is based in San Jose, CA, with periodic travel for customer and partner collaboration.
Key Responsibilities
SI/PI Architecture, Design & Analysis
- Develop SI and PI (DC, AC, PDN) designs for semiconductor test systems, including PCBAs, load boards, sockets, and interposers.
- Perform end‑to‑end channel analysis covering package, socket, PCB, cabling, and high‑speed interfaces (64 Gb/s+).
- Execute high‑speed SI modeling (S‑parameters, SERDES equalization, eye diagrams, BER, protocol verification).
Prototype Development & Validation
- Conduct hands‑on testing, qualification, and debugging of prototype assemblies and subsystems.
- Create test specifications, evaluation methods, and engineering change documentation.
- Interpret and present electrical performance data to senior engineers and stakeholders.
System Integration & Cross‑Functional Collaboration
- Work with manufacturing, quality, and technical support teams to define specifications and support supplier selection.
- Participate in design reviews and customer technical discussions.
- Provide mentorship and technical direction to junior engineers and contractors.
Project Ownership
- Identify risks, drive optimization opportunities, and lead technology development strategies.
- Maintain project schedules, including Gantt charts, and oversee smooth handoffs to Applications, Design, and Manufacturing teams.
- Support patent filings and invention documentation.
Additional Contributions
- Create test plans, procure required components, and oversee test execution.
- Perform tolerance analysis and function as a technical consultant in your domain.
- Contribute to independent design projects as assigned.
Required Qualifications
- BS in Electrical Engineering; MS preferred.
- BS +10 years or MS +7 years experience in SI/PI, high‑speed systems, or semiconductor‑related engineering.
- Expertise in:
- High‑speed SI/PI for PCB, package, and system‑level design
- High‑speed channel simulation tools (ADS, HFSS, CST)
- S‑parameter modeling and SERDES equalization
- High‑speed data communication measurements (eye diagrams, BER)
- PCIe or similar high‑speed serial interfaces
- PDN/power integrity for high‑power, high‑pin‑count devices
- Lab instrumentation: oscilloscopes, VNAs, TDR, spectrum analyzers, protocol analyzers
- Strong understanding of PCB materials and construction.
- Excellent communication, teamwork, analysis, and organizational skills.
- Ability to multitask and travel as needed.
Preferred Qualifications
- Experience with photonics or optical signaling.
- Background in semiconductor capital equipment design or certification.
- Cross‑functional system development experience (HW/ASIC/SW/Mechanical).
- Intermediate instrumentation and software skills.
- Japanese language skills.
FAQs
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