Hardware Engineering Manager
My Client is seeking a strategic, technically strong senior leader to drive the development and execution of advanced semiconductor test platform programs. This role requires deep expertise in test cell architecture, cross‑functional engineering leadership, and a thorough understanding of both wafer‑level and packaged device testing.
What You'll Do
- Lead test platform programs from concept through deployment, ensuring performance, reliability, and on‑time delivery.
- Direct and align multidisciplinary engineering teams, including:
- Mechanical Engineering: enclosure design, thermal management, structural integration
- Electrical Engineering: PCB design, power delivery, signal integrity
- Software Engineering: automation frameworks, analytics, UI development
- Firmware Engineering: embedded systems, instrumentation control
- Signal Delivery: high‑speed interconnects, probing technologies, test interfaces
- Oversee full semiconductor test cell integration-handlers, thermal systems, automation, and workflow optimization.
- Guide platform development for wafer‑level and packaged testing, collaborating with probe card and probing technology partners.
- Work closely with internal stakeholders and customers to define requirements and ensure successful adoption.
- Manage schedules, risks, and milestones while mentoring program managers and technical leads.
- Present regular status updates and strategic recommendations to senior leadership.
What You Bring
- Bachelor's or Master's in Electrical, Mechanical, or Computer Engineering
- 10+ years in semiconductor test systems, including 5+ years in leadership
- Proven success delivering complex, multidisciplinary test platforms
- Strong understanding of ATE systems, semiconductor manufacturing, and test methodologies
- Excellent organizational, communication, and strategic planning skills
Preferred Experience
- Semiconductor test cell architecture and system integration
- Wafer‑level and packaged device testing, including probe card and socket technologies
- High‑density interconnects, advanced‑node probing solutions
- High‑speed signal integrity and interface design
- Experience working with global teams and external suppliers
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